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Three-dimensional integrated circuit
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31	Amkor’s Next Generation Packaging Solutions … the future is now! Paul Silvestri I Director, TSV Product Development Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:19:08 Semiconductor device fabrication Microtechnology SDRAM Field-programmable gate array Xilinx 3DS Interposer Through-silicon via Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
32	3D IC WORKING GROUP MEETING OCTOBER 16, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronics Technology 3D computer graphics Three-dimensional integrated circuit Mentor Graphics Field-programmable gate array 3D modeling Back end of line Integrated circuit Electronic engineering Semiconductor device fabrication Visual effects
33	GSA 3D IC WORKING GROUP – ROADMAP SUBGROUP Progress Update 3D ROADMAP SUBGROUP MEMBERS Team Leader: Françoise von Trapp, 3D InCites Team Members: Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:30 Technology Semiconductor device fabrication Three-dimensional integrated circuit Technology roadmap
34	Low-Cost 3D Chip Stacking with ThruChip Wireless Connections [removed] [removed] [removed] Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2014-08-04 13:35:25 Electronic engineering Dynamic random-access memory Wafer backgrinding ANT Wafer Three-dimensional integrated circuit Through-silicon via Semiconductor device fabrication Technology Electronics
35	GSA 3D-IC WORKING GROUP UPDATE 3D IC Working Group Objective Promote adoption and proliferation of 3D-IC technology through education and sharing Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:02 Video game development Business model Three-dimensional integrated circuit Business Management Marketing 2.5D
36	Business Models to Support Supply Chain Readiness for Mainstream 2.5D & 3D Technologies Presented by Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:11 Electronic engineering Three-dimensional integrated circuit Chip scale package Wafer dicing Wafer Microelectromechanical systems Interposer EV Group Through-silicon via Semiconductor device fabrication Electronics Microtechnology
37	GSA Supply Chain Working Group Meeting Exar, Fremont, CA \| May 16, 2013 Supply Chain Working Group Meeting Minutes from the May 16, 2013 meeting Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:46:34 Management Supply chain Semiconductor fabrication plant Fabless semiconductor company Government procurement in the United States Wafer Three-dimensional integrated circuit Semiconductor device fabrication Technology Business
38	3D IC WORKING GROUP MEETING JANUARY 22, 2014 3D IC Working Group Meeting Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:53 Semiconductor device fabrication Three-dimensional integrated circuit
39	TIERLOGIC Taking semiconductors to the next level 3D FPGA & 3D ASIC Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:16:46 Electromagnetism Reconfigurable computing Field-programmable gate array Electronic circuits Fabless semiconductor companies Xilinx Three-dimensional integrated circuit Application-specific integrated circuit Bitstream Electronic engineering Electronics Integrated circuits
40	Market Trend with Packaging Technology Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:56 Integrated circuits Microtechnology Three-dimensional integrated circuit Ball grid array Quad-flat no-leads package Chip scale package Interposer Amkor Technology Flip chip Semiconductor device fabrication Electronics Electronic engineering